Flexible perovskite solar cells (PSCs) have been rapidly developed for realistic applications such as windows and auxiliary power supplies of other electronics. However, the penetration of moisture through the cell’s flexible substrate films still poses a major obstacle because it can destroy the perovskite active films under outdoor conditions. Unlike conventional PSCs with glass‐based encapsulation, flexible PSCs face challenges in finding suitable materials and structures that maintain flexibility while providing effective encapsulation. We propose simple encapsulation methods suitable for flexible PSCs using a transparent electrode‐integrated flexible barrier (TIFB) substrate comprising silicon nitride (SiNx)/polyethylene terephthalate (PET)/indium tin oxide (ITO). We deposit a dense SiNx layer with CVD on ITO‐PET films and achieve a more flexible TIFB than the conventional laminated substrate owing to its thinness. TIFB shows a low water vapor transmission rate (WVTR) of 4.3×10‐3 g/m2·day. Consequently, the efficiency of TIFB‐based PSCs under harsh conditions (60 °C and 90 RH%) exhibits an acceptable decrease within 10% of its highest efficiency after 400 h storage, which is the most stable data under high temperature and humidity among existing flexible encapsulated PSCs. TIFB, as a flexible substrate, is a major candidate to protect flexible electronics and PSCs against external factors.This article is protected by copyright. All rights reserved.